The Quorum E3100 large chamber critical point dryer has been an industry standard for over 35 years and is used in numerous scanning electron microscopy (SEM) laboratories around the world. Primarily used for critical drying of biological and geological specimens, the E3100 can also used for the controlled drying MEMs,  aerogels and hydrogels.

The Quorum GloQube® Plus is a cost-effective, compact and easy to use glow discharge system, designed to fulfil the needs of laboratories with TEM.

The Quorum K1050X is a modern, solid-state RF plasma barrel reactor designed to meet the requirements of research and development and small-scale production for a wide and varied range of plasma etching, plasma ashing and plasma cleaning applications.

The Quorum K850 combines versatility and ease of operation. Built-in thermo-electric heating and adiabatic cooling allow precise temperature control. The vertical pressure chamber (32 mm diameter x 47 mm) has a side viewing port, which gives a clear view of the liquid meniscus during filling. A magnetic stirrer ensures optimal mixing and exchange of process fluids.

The Quorum K850WM is a compact, bench-top instrument designed to critical point dry a complete 6″/150 mm wafer. A convenient wafer holder allows rapid transfer and ensures that pre-drying does not occur.

The Quorum Q150R Plus is suitable for use with Tungsten/LaB6 SEM and Benchtop SEM.

Typical uses: 

• Sputter coating of noble metals using the Q150R S & ES Plus:
• Recommended for magnifications:
• up to x 50k using Au, Au/Pd
• up to x 100k using Pt (optional)
• Carbon cord coating for elemental analysis using the Q150R E & ES Plus.

The Quorum Q150T Plus is optimised for use with a turbomolecular pump, which gives a lower vacuum down to 5 x 10-5 mbar. 

The Q150T Plus is available in three formats: 

Suitable for multi-layer sequential sputtering of two materials, the Quorum Q300T D Plus has two independent sputtering heads, which allows sequential sputtering of two metals without the need to break vacuum. The system is fully automated with user defined recipes controlling the pumping sequence, time, number of sputter cycles, and the current used during the process. Unlimited layers of varying thickness from two target materials can be sputtered sequentially by cycling between both targets.  When not in use the targets are shuttered for protection from contamination.